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In http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x27, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted socket strip SMD 2x27 2.00mm double row surface-mounted straight pin header, 1x22, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole IDC header, 2x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole straight socket strip, 2x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC header THT 2x19 2.00mm double row surface-mounted straight pin header, 1x01, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip, 2x40, 1.27mm pitch, 4.0mm pin length.

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