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900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 6.73 mm (264.

• 502585-1470 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator Fuse.
• Normal 2.554372e-001 4.462929e-001 8.576564e-001.
• Normal -0.773016 0.634386 0 vertex.

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