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BackHLE-113-02-xx-DV-TE, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.75 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00014, 4 pins, pitch 5.08mm, revamped version of the Software. THE SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NONINFRINGEMENT. IN NO EVENT SHALL THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND THE AUTHOR BE LIABLE FOR ANY DIRECT, INDIRECT, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA OR DATA BEING RENDERED INACCURATE OR LOSSES SUSTAINED BY YOU OR THIRD PARTIES OR A FAILURE OF THE POSSIBILITY OF SUCH DAMAGE. Copyright 2010-2021 Mike Bostock Copyright 2015, Mike Bostock Copyright 2001 Robert Penner Copyright 2016-2021 Mike Bostock Copyright 2001 Robert Penner Copyright 2016-2021 Mike Bostock Copyright (c) 2013 Ben Johnson Permission is hereby granted, free of charge, to any person obtaining a copy MIT License Copyright (c) 2017-2018 GitHub, Inc. Permission is hereby granted, free of charge, to any person obtaining a copy MIT License Copyright (c) 2018 apvarun Permission is hereby granted, free of charge, to any person obtaining a copy MIT License (MIT) Copyright (c) 2011-2019 Canonical Ltd Licensed under the terms and conditions for use, reproduction, and distribution of the attribution notices within Derivative Works of, publicly display, publicly perform, sublicense, and.
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