Labels Milestones
BackUFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout.
- | SW_DPDT_x2 | Switch, dual pole.
- 9.807881e-01 -1.950736e-01 1.021077e-03 vertex -1.044754e+02 9.769640e+01 2.655000e+01.
- 22 bottom-side contacts, 1.0mm.
- Vertex -9.202120e+01 1.036943e+02 2.655000e+01 facet normal.
- Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch.