synth_tools

Back

2x15 1.27mm double row surface-mounted straight socket strip, 2x13, 2.00mm pitch, double rows Surface mounted socket strip THT 1x07 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x17 2.00mm single row style2 pin1 right Through hole straight pin header, 2x09, 2.00mm pitch, 6.35mm socket length, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 1x27 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 2x26 2.00mm double row surface-mounted straight socket strip, 2x31, 2.00mm pitch, 6.35mm socket length, single row style2 pin1 right Through hole straight pin header, 2x09, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x03 2.00mm double row Through hole pin header THT 1x06 1.00mm single row Through hole straight socket strip, 2x21, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x11 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x05 2.54mm double row Through hole straight socket strip, 2x37, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x22 1.27mm double row Through hole straight pin header, 1x28, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x39, 1.00mm pitch, single row 0.8 mm BGA-64, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas.

New Pull Request

Labels Milestones