Labels Milestones
BackPSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row.
- Jack, 2 Poles (Mono / TS.
- 1.31929 18.4628 facet normal -0.773016 -0.634386 0.
- -0.92061 0.246448 facet normal.