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Package (JQ) - 4x4x0.5 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 22-lead.

• 3314G Potentiometer, vertical, Bourns 3386F, https://www.bourns.com/pdfs/3386.pdf.
• 0.940718 0.331812 -0.0703587 facet normal 0.0363633.

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