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(see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 32 leads; body width 4.4 mm; Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [UDFN] (see Atmel-8815-SEEPROM-AT24CS01-02-Datasheet.pdf DFN, 8 Pin (https://datasheet.lcsc.com/lcsc/2204011730_GigaDevice-Semicon-Beijing-GD5F1GQ4UFYIGR_C2986324.pdf (page 44)), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.25 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0405-0-51, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP24: plastic shrink.

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