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461, 4.63x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header SMD 2x15 2.00mm double row Through hole angled pin header, 2x34, 2.00mm pitch, single row Through hole straight socket strip, 2x25, 1.27mm pitch, single row Through hole angled pin header THT 2x36 1.27mm double row Through hole angled pin header THT 1x24 1.00mm single row Surface mounted socket strip SMD 1x03 2.54mm single row Through hole angled pin header, 2x32, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 1x32 1.27mm single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x18 2.00mm single row Through hole straight pin header, 2x37, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x14 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x30 2.54mm double row surface-mounted straight pin header, 2x35, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x18, 2.54mm pitch, single row Surface mounted socket strip THT 2x46 1.27mm double row Through hole.

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