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Ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 8 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 32 leads; body width 4.4 mm; Exposed Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://www.nxp.com/docs/en/data-sheet/MMZ09332B.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 5.9 mm (232 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL ZIF 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm.

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