Labels Milestones
BackWith SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SS)-5.30 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (https://www.onsemi.com/pub/Collateral/NCN4555-D.PDF), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height.
- 0.0497453 0.0861612 0.995039 facet normal 0.554737 0.0546401 0.83023.
- 4.58534 4.28788 7.81694 facet normal.