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Ublox LEA 6/7/8 ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox LEA 6/7/8 ublox NEO 6/7/8, (https://www.u-blox.com/sites/default/files/NEO-8Q-NEO-M8-FW3_HardwareIntegrationManual_%28UBX-15029985%29_0.pdf GPS ublox NEO 6/7/8 GPS Module, 15.5x15.5x6.3mm, https://www.u-blox.com/sites/default/files/SAM-M8Q_HardwareIntegrationManual_%28UBX-16018358%29.pdf GPS GNSS ublox ZED GSM NB-IoT Module BC66 M66 GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module, 19.9x23.6x2.2mm, https://www.quectel.com/UploadImage/Downlad/Quectel_BC95_Hardware_Design_V1.3.pdf GSM NB-IoT module BC95 Quad-Band GSM/GPRS module, 17.6x15.7x2.3mm, http://simcom.ee/documents/SIM800C/SIM800C_Hardware_Design_V1.05.pdf Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 19.9x23.6x2.65mm, https://www.quectel.com/UploadImage/Downlad/M95_Hardware_Design_V1.3.pdf Quad-Band GSM/GPRS module, 24x24x3mm, http://simcom.ee/documents/SIM900/SIM900_Hardware%20Design_V2.05.pdf Telit xL865 familly footprint, http://www.telit.com/fileadmin/user_upload/products/Downloads/3G/Telit_UL865_Hardware_User_Guide_r8.pdf ublox Sara GSM/HSPA modem, https://www.u-blox.com/sites/default/files/SARA-G3-U2_SysIntegrManual_%28UBX-13000995%29.pdf, pag.162 ublox SARA-G3 SARA-U2 GSM HSPA Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern PL-012, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-236, including GND vias (https://www.minicircuits.com/pcb/98-pl176.pdf Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl052.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern PL-012, including GND vias (https://ww2.minicircuits.com/pcb/98-pl012.pdf Mini-Circuits top-hat case DB1627 (https://ww2.minicircuits.com/case_style/DB1627.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf) following land pattern PL-035, including GND-vias (https://ww2.minicircuits.com/pcb/98-pl035.pdf Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf Footprint for Mini-Circuits case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case CK605 (https://ww2.minicircuits.com/case_style/CK605.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai Thinker Ra-01 LoRa module wireless zigbee 802.15.4 flash crypto ATSAMR21G18 AT45DB041E TECC508A U.Fi Class 4 Bluetooth Module with on-board components hard_sync traces added but maybe won't keep Fireball/Fireball.kicad_prl | 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf USON, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 48 Pin (https://www.onsemi.com/pub/Collateral/485BA.PDF), generated with kicad-footprint-generator Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-107-02-xxx-DV-BE, 7 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 6, Wuerth electronics 9774100951 (https://katalog.we-online.de/em/datasheet/9774100951.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5170, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator JST J2100 series connector, 53780-0570 .

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