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18-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils.

• -9.992182e-001 -4.449183e-003 3.928455e-002 vertex.
• 0.962633 -0.191482 -0.191502 facet normal 0.195085 -0.980786.
• Runs anywhere Go can compile for: Windows.

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