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Mm Power-Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 9.78x12.34mm (see e.g.

• 0.119237 0.98763 facet normal 0.39254.
• Kicad-footprint-generator Diode SMD 01005.
• MCV_1,5/4-G-3.81; number of pins: 16; pin pitch.
• 8.66595 1.30618 12.2548 facet normal 3.622948e-07 -1.000000e+00.
• Representative footprints. Consider adding.

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