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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 8 Pin (https://www.ti.com/lit/ds/symlink/ina333.pdf#page=30), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 2.33mm Height, Right Angle, Surface Mount, ZIF, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf molex FFC/FPC connector Pitch 0.5mm vertical Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 24 Circuits (https://www.molex.com/pdm_docs/sd/2005280240_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py Infineon PG-DSO 12 pin, exposed pad, 4x4mm body, pitch 0.5mm, thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 11.6, Wuerth electronics 9774040482 (https://katalog.we-online.de/em/datasheet/9774040482.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, 505405-1270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Hirose series connector, S26B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, SM10B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Inductor SMD Wuerth WE-DD TypL TypXL TypXXL Shielded Coupled Inductor, Wuerth Elektronik, Wuerth_HCI-1030, 10.6mmx10.6mm inductor Wuerth hcm smd Inductor, Vishay, IHLP series, 4.1mmx4.1mm Inductor, Vishay, IHLP series, 3.0mmx3.0mm inductor vishay icsm smd Inductor, Vishay, IHLP series, 4.1mmx4.1mm Inductor, Vishay, IHLP series, 3.0mmx3.0mm inductor vishay ihlp smd Inductor, Wuerth Elektronik, Wuerth_HCI-1335, 12.8mmx12.8mm Inductor.

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