Labels Milestones
BackBGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole pin header THT 2x10 2.54mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x13, 5.08mm pitch, single row Through hole IDC header, 2x08, 2.54mm pitch, single row (from Kicad 4.0.7), script.
- -9.99456 1.98804 2.19603 vertex 9.91954 1.97312 2.58057 facet.
- Works based on either.
- 5267-10A, 10 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator.
-
X="3.75" y="2.6"/>