3
1
Back

BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x21, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted pin header THT 2x30 2.54mm double row Through hole angled pin header THT 2x21 1.27mm double row Through hole angled socket strip, 1x40, 1.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x18, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x07 2.54mm single row Through hole angled pin header, 2x36, 1.27mm pitch, double rows Through hole angled socket strip THT 2x07 2.54mm double row.

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