Labels Milestones
BackSide entry JST NV side entry Molex Mini-Fit Sr. Power Connectors, 43915-xx14, With thermal vias in pads, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/tqfp_edsv/sv_100_4.pdf), generated with kicad-footprint-generator JST XA series connector, 64800611622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, SM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.25 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Tantalum Capacitor SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-6.pdf Mini-Circuits Filter SMD 1206 https://ww2.minicircuits.com/case_style/FV1206-4.pdf Mini-Circuits Filter SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 2.5, Wuerth electronics 9774090951 (https://katalog.we-online.de/em/datasheet/9774090951.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-3/ Infineon PG-TO-220-7, Tab as Pin 8, see e.g. Https://www.infineon.com/dgdl/Infineon-BTS50055-1TMC-DS-v01_00-EN.pdf?fileId=5546d4625a888733015aa9b0007235e9 Nexperia CFP15 (SOT-1289), https://assets.nexperia.com/documents/outline-drawing/SOT1289.pdf On Semiconductor ECH8, https://www.onsemi.com/pub/Collateral/318BF.PDF Low Profile Inductor, Vishay, Vishay_IHSM-5832, http://www.vishay.com/docs/34020/ihsm5832.pdf, 16.3mmx8.1mm Inductor, Vishay, IHLP series, 3.0mmx3.0mm inductor vishay icsm smd Inductor, Vishay, IHLP series, 4.1mmx4.1mm Inductor, Vishay, IHLP series, 17.0mmx17.0mm Inductor, Vishay, Vishay_IHSM-7832, http://www.vishay.com/docs/34021/ihsm7832.pdf, 19.8mmx8.1mm inductor shielded wuerth hcf Inductor, Wuerth Elektronik, Wuerth_MAPI-4030, 4.0mmx4.0mm Shielded Coupled.