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LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module.

• Glide in (j16/j17) // cv.
• 1x32 1.00mm single row style2 pin1 right.
• Coil, Inductor, Ms36-L, SMD.

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