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LFBGA-448, 18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=27 FBGA-96, 14.0x8.0mm, 96 Ball, 9x16 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (ST)-4.4 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body (http://www.ti.com/lit/ml/msop002a/msop002a.pdf SOIC, 16 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_UQFN_4x4x0_5mm_JQ_C04257A.pdf), generated with kicad-footprint-generator JST ZE series connector, LY20-34P-DT1, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0530, 5 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.75 mm² wires, reinforced insulation, conductor diameter 2mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, B14B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST XH series connector, 502585-0570 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (https://www.nxp.com/docs/en/package-information/SOT407-1.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 5.6, Wuerth electronics 9775096960 (https://katalog.we-online.com/em/datasheet/9775096960.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

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