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BackCorrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch.
- Specification.pdf Normal file View File 3D.
- HLE-138-02-xxx-DV-BE-LC, 38 Pins per.
- EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up.