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PCB's with 20 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 50 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 40 contacts (not polarized Highspeed card edge connector for 1.6mm PCB's with 20 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (not polarized Highspeed card edge connector for 2.4mm PCB's with 50 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 70 contacts (polarized Highspeed card edge connector for 1.6mm PCB's with 05 contacts (polarized conn samtec card-edge socket high-speed 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 6.7x9.18mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile DIP Switch SPST Slide 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 9x-dip-switch SPST , Piano, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm 22.86mm 900mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Open Source Hardware Logo Polarity Logo, Center Positive Restriction of Hazardous Substances Directive Logo Symbol, Attention, Copper Top, Small, Waste Electrical and Electronic Equipment Directive Altech AK300.

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