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Back6 pins package 1x0.8mm pitch 0.35mm SOT-1123 small outline package; 18 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 24 leads; body width 4.4 mm; thermal pad.
- Dust Water TDK InvenSense Knowles MEMS I2S SPH0645LM4H.
- -0.0461938 0.808201 vertex 6.07199 0 19.1916 vertex.