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Body [VDFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 12-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 14-Lead Plastic Thin Shrink Small Outline (SN) - Narrow, 3.90 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00482-02.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator Stocko RFK MKS 16xx series connector, DF3EA-08P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-1210, 12 Pins.

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