Labels Milestones
Back10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x24 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x11 1.27mm double row Through hole angled socket strip, 2x06, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x24 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x36 2.00mm double row Through hole angled pin header, 1x37, 1.00mm pitch, 2.0mm pin length, single row Through hole socket strip SMD 1x22 1.00mm single row Surface mounted pin header THT 1x24 2.54mm single row (from Kicad 4.0.7), script generated.
- Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator Samtec HLE .100.
- Handsoldering NF-Transformer ETAL P3191 SMD.