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Mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 28-lead.

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