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Size 10x8.3mm^2, drill diamater 1.15mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wire, reinforced insulation, conductor diameter 0.65mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, SM26B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Lead Frame Chip Scale Package, 3x3mm, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 12 bottom-side contacts, 1.0mm pitch, 1.0mm height, SMT, http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=84953&DocType=Customer+Drawing&DocLang=English&DocFormat=pdf&PartCntxt=84953-4 TE FPC connector, 22 top-side contacts, 0.5mm pitch, 1.854mm thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CM.PDF DFN, 14 Pin (JEDEC MO-153 Var JC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (JEDEC MS-013AC, https://www.analog.com/media/en/package-pcb-resources/package/233848rw_20.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV, 30 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, BM06B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-05P-1.25DS, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a label // internal clock rate. Schematics/Unseen Servant/fp-info-cache Normal file Unescape Latest commits for file Schematics/SynthMages.pretty/Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles_Socket_Centered.kicad_mod Binary files /dev/null and b/HIHAT_MANUAL.pdf differ Binary files /dev/null and b/SR 1.pdf differ Binary files /dev/null and b/3D Printing/Panels/FIREBALL VCO.png create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-F_SilkS.gbr create mode 100644 Schematics/SynthMages.pretty/Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles_Socket_Centered.kicad_mod create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Panel_Dual_Slotted_Mounting_Hole_NPTH.kicad_mod delete mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Pot_Hole.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel.gbrjob create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x08_P2.54mm_Vertical.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PPTC_RXEF025.kicad_mod delete mode 100644 Schematics/SynthMages.pretty/SOCKET_3_PIN_HEADER_NORMAL.kicad_mod From 5663c8bc865b744661cf82b1abfca64d73c0f2fa Mon Sep 17 00:00:00 2001 Subject: [PATCH 01/13] initial notes for v1 front panel components and the following procedure for assembly. As usual do the lowest components first — resistors.

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