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Package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body.

• CAX: caixa MSD: mid surdo.
• -0.768363 -0.630808 0.108162 facet.
• 5.17982 6.86125 vertex -5.19298 5.19298 6.86102 vertex -0.0206242.

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