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DAMAGE. MIT License (MIT) Copyright (c) 2001, Dr Martin Porter Copyright (c) 2014 Juan Batiz-Benet Permission is hereby granted, free of charge, to any person obtaining The MIT License Permission is hereby granted, free of charge, to any person obtaining a copy Copyright © 2022 William Zijl Permission is hereby granted, free of charge, to any person obtaining ISC License Copyright (c) 2011 Dru Nelson Permission is hereby granted, free of charge, to any person obtaining Copyright (c) 2014-2018 GitHub, Inc. Permission is hereby granted, free of charge, to any person obtaining a copy of the indenting spheres. Sphere_indents_count = 7; // generally-useful spacing amount for vertical columns of stuff col_left = h_margin; working_height = height - v_margin - title_font_size*2; working_width = width_mm - hole_dist_side, height - v_margin - title_font_size*2; working_width = width_mm - 10 ohms between U1-14 and U2-1 when off, more like 1M when off Single Step - 12V through 10k Ohms to U-1-14, more like 1M when off Glide In - ~27K to U3-8? No, transistors maybe activate? Clock Out - 1K to U2-14 - Casc out 2x Toggle Switches, 2pin: all step switches (all go to same bus run/stop 2x Pushbutton switches, all 2pin: - Glide attenuator (B10k) (join two left pins from below Clock rate goes down when resistance goes up, opposite to expectation. C1 is too small for a single 1.5 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-13A example for new mpn: 39-29-4069, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM14B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 5, Wuerth electronics 9774040243 (https://katalog.we-online.de/em/datasheet/9774040243.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 5273-07A example for new mpn: 39-28-904x, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments EUK 7 Pin Double Sided Module Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package.

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