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Plasic small outline package; 44 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot370-1_po.pdf SSOP56: plastic shrink small outline package; 8 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-16/CP_16_22.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.1 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556444-da-01-de-LEITERPLATTENKL__PTSM_0_5__4_2_5_V_THR.pdf, script-generated with , script-generated with , script-generated with , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type171_RT13705HBWC pitch 7.5mm Varistor, diameter 7mm, width 4mm, pitch 5mm size 50x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00239, 9 pins, pitch 3.5mm, size 53.2x7mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00045, 2 pins, pitch 3.81mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test Point, square 3.0mm side length, hole diameter 1.3mm, hole diameter 1.0mm test point THT pad as test point, loop diameter 3.8mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop with bead as test point, loop diameter 3.8mm, hole diameter 2.8mm SMD rectangular pad as.

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