Labels Milestones
Back14-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads.
- Length 21mm width 10mm.
- Circuit's VCA v1.3. D952ec97f3 Go to file.
- (https://katalog.we-online.de/em/datasheet/9774015360.pdf), generated with kicad-footprint-generator Molex.
- D="m 3.5236177,4.5275604 h -0.19685" d="M.