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Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1.

• Micro-B horizontal SMD USB 2.0 Type.
• QuentinEF.ttf => Panels/QuentinEF.ttf | Bin 0 -> 2441420.

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