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For voltage clearance (UCC256301, https://www.ti.com/lit/ds/symlink/ucc256301.pdf SOIC, 14 Pin (JEDEC MO-153 Var DD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection, for 2 times 0.75 mm² wire, reinforced insulation, conductor diameter 2.4mm, see http://www.4uconnector.com/online/object/4udrawing/10684.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal.

8.9219 -4.12097 1.53167 facet normal 0.630746 0.768414 0.108161.
"License"); MIT License (MIT) Copyright (c.
DAMAGES WHATSOEVER RESULTING FROM LOSS OF USE.
10.1521 2.19603 vertex 3.87041 9.34401 2.58057.

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