Labels Milestones
Back5566-14A2, example for new part number: 26-60-5060, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 10x10x0.9 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 32-lead dip package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row.
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