Labels Milestones
BackPlastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBJ0008 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered.
- -0.678848 0.362852 -0.63836 facet normal.
- 7.91987 -1.57536 5.88782 facet normal 0.243768.
- See: https://www.nxp.com/docs/en/data-sheet/KTY81_SER.pdf [StepUp generated footprint] SOT-227.
- Connector https://www.we-online.com/catalog/datasheet/614004134726.pdf Stacked USB A connector.
- For: MSTBA_2,5/16-G-5,08; number of pins: 12; pin.