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2.1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV-A, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0310, with PCB locator, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XA vertical boss JST XH series connector, BM06B-GHS-TBT (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, 501331-0407 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, 105313-xx05, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-16A1, example for new part number: A-41792-0017 example for new mpn: 39-28-902x, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-130-xx.x-x-DV-N, 30 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic XDFN (1.35mm x 2.2mm) (see https://www.onsemi.com/pdf/datasheet/emi8132-d.pdf Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON QFN, 24 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator ipc_noLead_generator.py DE Package; 16-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] with thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (https://www.st.com/resource/en/datasheet/stp16cp05.pdf#page=25), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 64 Pin (https://www.silabs.com/documents/public/data-sheets/cp2108-datasheet.pdf), generated.

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