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BackBody [DFN] (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=59), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0408, 40 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-02A, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF63-6P-3.96DSA, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-50DP-0.5V, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB cutout, light-direction upwards, see https://www.everlight.com/file/ProductFile/ITR1201SR10AR-TR.pdf reflective opto couple photo coupler package for diode bridges, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 3x-dip-switch SPST KingTek_DSHP03TS, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD.
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