Labels Milestones

Back

BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 15.24.

• 100644 Hardware/PCB/precadsr_Gerbers/precadsr-job.gbrjob create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-B_Cu.gbr create mode.
• Copyright 2001 Robert Penner Copyright 2016-2021 Mike Bostock.
• 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects