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Socket 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Surface mounted pin header SMD 1x16 1.00mm single row Surface mounted pin header THT 1x18 5.08mm single row Through hole socket strip SMD 1x39 1.00mm single row Through hole straight pin header, 2x09, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 1x07 1.00mm single row Through hole straight socket strip, 1x28, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x25, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x16, 2.00mm pitch, 6.35mm socket length, double rows Surface mounted socket strip THT 1x12 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x05 2.54mm single row Through hole pin header SMD 1x05 1.00mm single row Through hole IDC header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 2x20 2.00mm double row surface-mounted straight pin header, 2x26, 2.00mm pitch, double rows Surface mounted pin.

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