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Package 14-lead dip package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf QFN, 64 Pin (https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT2232H.pdf#page=57), generated with kicad-footprint-generator JST XA series connector, 501331-1207 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Resistor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size from: http://datasheets.avx.com/NOS.pdf), generated with kicad-footprint-generator connector wire 0.1sqmm strain-relief Soldered wire connection, for 5 times 0.127 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer diameter 3mm, see http://www.produktinfo.conrad.com/datenblaetter/550000-574999/556441-da-01-de-LEITERPLATTENKL__PTSM_0_5__8_2_5_H_THR.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block 4Ucon ItemNo. 10697, vertical (cable from top), 8 pins, pitch 5.08mm, size 25.4x10.6mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10700.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00003 pitch.

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