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Not quite parallel, but they're close. ## Assembly order I suggest the following procedure for assembly. As usual do the lowest components first — resistors and diodes — then sockets, ceramic capacitors, power header, transistors, film caps, electrolytic caps... Something like that. Latest commits for file Images/loop.png d8deca9307 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin' b96c823428337e1169ae4a0f1d50e46562744447 Add '3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin/HOLD PORTAL.png differ Binary files a/Hardware/Panel/precadsr_panel.png and /dev/null differ From 73e3e5201264e94fbdc754390f9ba14dc3db9a16 Mon Sep 17 00:00:00 2001 .../Panels/FIREBALL VCO.png | Bin 12821 -> 0 bytes From b2f0340111348a8deafde0ffe244939fe4eeb6b7 Mon Sep 17 00:00:00 2001 eb8580ef62 Undo converting GND to GND_JMP and fix everything that broke 3583986e89 Finished PCB, passes all passable DRCs Footprint selection, some PCB layout choices Add CV in to pause the clock feature/seq_chaining Checkpoint before trying to fit in glide controls From a5c5ff12ce18fecaaf346f973863d12bf361ac82 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Update Schematics/schematic_bugs_v1.md more fixes - Gate out (could normal to TP10, optional Once/Cont 11 Toggle Switches, 3pin: 11 Toggle Switches, 2pin: - Glide attenuator.

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