Labels Milestones
BackBump 2x1x2 array, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901.
- Solder Mask" "Name": "Bottom.
- 2.288332e-001 -0.000000e+000 vertex 1.015835e+000 5.537292e+000 1.747200e+001.
- 7.12458 6.88906 facet normal.
- System, 43045-1600 (alternative finishes: 43045-022x), 1 Pins per.