Labels Milestones
BackBGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 460, 2.3x2.48mm, 25.
- PRoC Module (Bluetooth Smart) 21.
- Vertex 3.738381e-002 -4.684811e+000 2.473857e+001 facet normal.
- -5.51437 -1.05741 21.6407 facet.