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WAGO 236-205, 45Degree (cable under 45degree), 6 pins, http://www.ti.com/lit/ds/symlink/tps737.pdf module CMS SOT223 8 pins, single row Through hole angled pin header THT 2x12 2.54mm double row Through hole socket strip THT 2x02 2.54mm double row surface-mounted straight pin header, 2x19, 2.54mm pitch, single row Through hole pin header SMD 1x13 1.00mm single row Surface mounted pin header THT 1x25 2.54mm single row style2 pin1 right Through hole Samtec HPM power header series 11.94mm post length THT 1x17 1.27mm single row style2 pin1 right Through hole angled pin header SMD 2x29 2.54mm double row Through hole straight socket strip, 1x10, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight pin header, 1x36, 2.00mm pitch, single row Surface mounted pin header SMD 1x40 1.27mm single row Through hole angled socket strip THT 2x08 2.00mm double row Through hole socket strip SMD 1x09 2.54mm single row Through hole socket strip SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, open SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, open, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 bridged with 2 copper strips SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 1x12 1.27mm single row style2 pin1 right Through hole straight pin header, 2x13, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole pin header THT 2x24 2.54mm double row surface-mounted straight pin header, 2x26, 1.27mm pitch, 4.0mm pin length, single row male, vertical entry, strain relief clip Harwin LTek Connector, 17 pins, single row Through hole straight pin header, 1x07, 2.54mm pitch, 6mm pin length, single row Through hole IDC header, 2x30, 1.00mm pitch, 2.0mm pin length, double rows Through hole Samtec HPM power.

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