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2x22 2.54mm double row Through hole socket strip THT 1x08 2.54mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x22 1.27mm single row Surface mounted socket strip THT 2x05 2.54mm double row surface-mounted straight pin header, 2x22, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x37, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header, 1x08, 1.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x40, 2.54mm pitch, double rows Through hole straight socket strip, 1x33, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x06 2.00mm double row surface-mounted straight pin header, 2x33, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x04 1.27mm double row Through hole angled pin header, 2x24, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package.

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