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0.8 CS325 CSG235 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (3mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 28 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 48 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ada4898-1_4898-2.pdf#page=29), generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B34B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Hirose DF63 vertical Hirose DF63 through hole, DF13-15P-1.25DS, 15 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator JST J2100 series connector, S04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-102-02-xxx-DV-LC, 2 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5268-13A, 13 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89018xx, 18 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000994748), generated with kicad-footprint-generator Molex Panelmate series connector, BM05B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF63M-1P-3.96DSA, 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, S13B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wire, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST XA horizontal JST EH series connector, 53398-1471 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (http://www.ti.com/lit/ds/symlink/tusb8041.pdf#page=42), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector Molex Micro-Fit_3.0 horizontal connector Molex PicoBlade side.

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