Labels Milestones
BackMils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP.
- [SOIC], pin 7 removed (Microchip Packaging.
- Copy ISC License Copyright (c) 2019 Go.
- HLE-125-02-xxx-DV-BE, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf.