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To clone: submodules avoid non-circular holes in footprints whenever possible; some fabs charge more for ovals vias connect.

• 1.036085e+01 vertex -1.076661e+02 9.665134e+01.
• Pin pitch, compatible with SOIC-8, 3.9x4.9mm body.
• 2.294371e-01 vertex -1.093365e+02 9.665134e+01 1.015828e+01 facet.

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