Labels Milestones
BackBody, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 20 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (3mm x 2mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package https://www.fairchildsemi.com/package-drawings/MA/MA03B.pdf 6-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf.
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