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Kemet EC2 signal relay DPDT non single coil latching, https://content.kemet.com/datasheets/KEM_R7002_EC2_EE2.pdf Kemet EC2 signal relay DPDT non single coil latching through hole 3.2mm, height 5.1, Wuerth electronics 9771090360 (https://katalog.we-online.com/em/datasheet/9771090360.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 502443-0770 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 40 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=345), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.ti.com/lit/ds/symlink/ads127l01.pdf#page=87), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-138 , 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (https://www.onsemi.com/pub/Collateral/561AV.PDF), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-80DP-0.5V, 80 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 55560-0301, 30 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.1 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf.

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